TR7006 separates products with bad solder printing at the beginning of the SMT process. This has two benefits: it can immediately offer the information to the solder printer to modify the parameters, and it also helps to avoid producing defective products. Thus, TR7006 increases productivity and reduces the cost of manufacturing and repair.

• In-line SPI system with ultra-high inspection speed using the dynamic imaging method for pre-/post-reflow PCBA inspection.

• Excellent 3D inspection and operation technology with warp auto-tracking system, provides outstanding defect-detecting ability.

• Great inspection ability of lead-free manufacturing process and fine pitch/ 01005 components.

• Smooth Automatic Test Program Generator (ATPG) flow lets users create inspection programs quickly and easily.

• Modularized mechanism system provides convenient way to fix or maintain the machine.

• SPC system calculates the statistical data and provides statistical reports.

• Available to link with YMS to integrate and analyze the data of all production lines.