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Quality at the start of the SMT process comes from improving the quality of solder paste printing. TRI’s three-dimensional solder paste inspection system can quickly measure the area, volume, and thickness of every solder joint and can detect short circuits. It is ideal for small, high-density products, preventing bad connections as a result from small solder joints and lack of solder, component vibration and heat expansion, improving the product's quality.

The TR7007 ultra-high-speed 3D Solder Paste Inspection adopts the Fringe Pattern Technology and dual light source, can solve the shadow and reflection problem simultaneously. It is equipped with a linear motor and linear scale that provides a highly accurate X-Y Table system.

Features:

  • Full 3D scan at maximum 87cm2/ sec @ 10µm resolution
  • Fringe Pattern Technology.
  • Shadow Free.
  • Linear motor and linear scale create an even-more precise and stable X-Y table motion system.
  • Excellent 3D inspection and operation technology with warp auto-tracking system, provides outstanding defect-detecting ability.
  • Great inspection ability of lead-free manufacturing process and fine-pitch/01005 components.
  • Smooth Automatic Test Program Generator (ATPG) flow lets users create inspection programs quickly and easily.
  • SPC system calculates the statistical data and provides statistical reports.
  • Available to link with YMS to integrate and analyze the data of TRI systems across all production lines.
  TRI
TR7007
C COMPANY
XX-500
K COMPANY
A-2
Fringe Pattern
Inspection Speed 171 cm2/s (14μm)
87 cm2/s (10μm)
80 cm2/s (15μm) 47 cm2/s(15μm)
21cm2/s(10μm)
2D color X X
Shadow Free X
Linear Motor(X,Y) Ball Screw
AC Servo
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