Koh Young: Future Forum 2023

June 8, 2023

Building on the success of the 1st Future Fourm webinar 2023, we are eager to introduce our next session: "Essential Inspection Requirements for the Era of Convergence: Optimizing the Semiconductor and SMT Processes".

   Due to the sophistication of mobile phones and automotive electronic products, highly challenging inspection objects at the semiconductor package manufacturing level have emerged in the SMT process. The inspection of various SiP products is an example. SMT processes such as Wafer Level SiP and Embedded PCB are also being applied in the semiconductor package manufacturing process. This webinar session will expand on how the two industries have been converging their boundaries and the impact of such a paradigm shift.

When: Thu, 15 June 2023 10:00AM PST

Where: Zoom Meeting

Sign Up Link: https://us06web.zoom.us/webinar/register/3116825778452/WN_gxCj5s4WRGqyKX9d-7_CEg#/registration